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Teledyne Microelectronic Technologies, a DOD Trusted Source for Microelectronics, is a leading supplier of multichip modules (MCMs) and custom microelectronics packaging solutions.
We provide turnkey design, manufacturing, test services and technical expertise to the DOD community, medical, communications and high-end industrial markets and are internationally known for our complex packaging and miniaturization solutions where size and weight are critical parameters and performance must be optimized.
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Breakthrough Collaborations
Reduce size, weight and power while improving performance
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Optoelectronics
Fiber optic transmitters , receivers, transceivers; detachable fiber connector or pigtailed; SFF, Mini, Chip Scale Package (CSP) up to 10 Gbps
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RF/Microwave
Low noise amplifiers, multi-throw switch assemblies, frequency doublers, up/down converters, detector log video amplifiers, successive detection log amplifiers
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Mixed Signal
Signal processing, interface control modules, memory modules, armament control, avionics LED display modules
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Space
Class K space level modules for spacecraft, satellites, launch vehicles, reentry vehicles
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Secure Communications
FIPS 140-2, anti-tamper coatings, intrusion detection technologies, encryption protection
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Power
Solid state power controllers, power converters, solid state switching |
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LED-based Backlighting and Illuminators
High performance LED backlights, LED collimating illuminators and optics for LED light sources
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