High Density Interconnects

Full range of high density packaging solutions for the most demanding applications
Learn More

RF/Microwave Assemblies

Full range of packaging solutions for RF/Microwave modules with testing up to 65 GHz
Learn More

Optoelectronic Modules

Design, packaging and testing solutions for Industrial, Military and Aerospace optoelectronic modules
Learn More

Space Microelectronics

High-reliability MIL-PRF-38534 Class K microelectronics for space applications
Learn More

Secure Communication Devices

Full range of solutions for cryptographic and secure communication devices
Learn More
  • Overview

    In this world of rapidly changing technologies, one constant is the need for continually increasing the density of electronic circuits to meet the size and weight constraints of ever more complex systems.
    For 50 years, Teledyne Microelectronics has met the challenge with creative packaging solutions for today’s most demanding applications.
  • Tech Videos

  • News & Press Releases

    Teledyne Microelectronic Technologies Celebrates Half a Century of Innovation  - Image
    Teledyne Microelectronic Technologies Celebrates Half a Century of Innovation
Teledyne Microelectronics | 1425 Higgs Road -|Lewisburg, TN 37091 / Terms and Conditions
310.574.2082 • 800.518.1015 | microelectronics@teledyne.com
Copyright 2014 Teledyne Technologies Incorporated. All rights reserved.