The key to successful microelectronic design and manufacturing is the recognition of performance, reliability and environmental requirements. Along with military/aerospace reliability and environmental concerns come the challenges of meeting overall size/weight constraints. Moreover, increasing operating frequencies, data rates and circuit complexity demand substrate technologies that offer finer features and geometry. In response, Teledyne Microelectronic Technologies offers the following portfolio of substrate solutions that meet the requirements of military, aerospace and medical electronic industries. Thick Film Substrates Au/Ag on Al2O3, BeO, AlN Diffusion Patterning™, Fodel®, Etchable 0.002" lines/spaces Integral Resistors and Capacitors Hi-Frequency layout and process, 20 GHz applications Thin Film Substrates Ti-W, Au, Ni, NiCr, TaN on Al2O3, BeO, AlN Thermal Evaporation & Sputter Deposition 0.001" lines/0.0005" spaces 50-200 ohms/sq. resistors LTCC, HTCC and HITCE™ Laminates FR 4 Polyimide Rigid-Flex Insulated Metal Proprietary High Tg(BT, BN)