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Analog/Digital Capabilities
 

  • Power Hybrids:
    • Power conditioners and controllers
    • Power bridges
    • Voltage converters
  • Solid State Relays:
    • TTL/CMOS compatible
    • SMT or through hole I/O
    • Integral over current/temp protection
  • Custom Digital/Analog Hybrids:
    • High density processors with CPU, memory and µcontrollers
    • A/D and D/A converters utilizing microwave design rules for high speed clock routing
  • Security Modules utilizing:
    • Tamper detection and zeroize circuitry
    • Passive coatings to prevent physical examination
    • Intervention circuitry to detect and mitigate tampering
  • Analog/Digital Designs:
    • High density microprocessors with CPU, memory and logic controllers
    • A/D and D/A converters incorporating microstrip design with clock frequencies to 1.5 GHz
    • Single and mixed function MCMs
      - Memory modules
      - Signal conditioners
    • MCM-C, D & L substrates
    • Fine line capability (0.004" pitch, 0.004" vias)
    • Advanced fine line, controlled impedance, low-K dielectric and thermal management techniques high speed functional, parametric and dynamic testing
    • Boundary scan for digital circuits
    • Active or passive laser trim




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Teledyne Microelectronics • 12964 Panama Street, Los Angeles, CA 90066
310.822.8229 • 800.518.1015 | microelectronics@teledyne.com
Copyright © 2010 Teledyne Technologies Incorporated. All rights reserved.