Teledyne Microelectronic Technologies provides a full range of build to print packaging services for digital and analog hybrids and multichip modules.

We are recognized as the market leader for Military, Aerospace, and Medical programs, offering over 40 years experience with signal processing, interface control modules, memory modules, armament control, avionics, power modules, implantable medical devices and LED display modules.

Give us your most complex circuits and we will: enhance your design for manufacturability, miniaturize size and reduce weight, maintain or enhance performance and reliability, maximize thermal management, and provide comprehensive testing and screening.