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Terms and Conditions

Class K - Space Applications

Teledyne Microelectronic Technologies is certified to build microelectronics and multichip modules for space flight, satellite and other unmanned equipment where failure is not an acceptable option. The table shows the differences in testing requirements for MIL-PRF-38534 Class K vs. Class H.

Class K vs. Class H

The areas in RED show the items that are required for Class K but are not required for the next lower class, Class H

Class H

Class K

Screen

 

 

Materials and Components

 

 

Active Elements (every wafer lot)

X

X

         100% high magnification visual

X

X

         100% probe at room temperature

 

X

         Samples assembled and put through standard environmental screening including burn-in and electrical at min, max and room temp

 

X

         Life test

 

X

         Scanning Electron Microscope (SEM)

X

X

         Wire bond pull

 

 

Passive elements (capacitors, resistors, inductors per component manufacturing lot)

X

X

         100% visual

 

X

         100% electrical on select parameters at room temp

X

X

         Sample assembled and screened including voltage aging and full electrical at room temp

X

X

         Wire bond pull

 

 

Packages (samples per plating lot, Group D if performed in-line)

X

X

         Physical dimensions

X

X

         Solderability

X

X

         Thermal shock, high temp bake, lead integrity, seal

X

X

         Salt atmosphere (one time)

X

X

         Metal package isolation

 

 

Hybrid Microcircuit 100% Testing

 

X

         Non-destructive bond pull

X

X

         Internal visual inspection

X

X

         Temperature cycling 10 times from -65C to 150C

X

X

         Constant acceleration 3,000 G

 

X

         PIND 1% PDA on 5th run and under 25T total

X

 

         Burn-in 160 hours at 125C, PDA 10%

 

X

         Burn-in 320 hours at 125C, PDA 2% second half of burn-in

X

X

         Seal (fine and gross)

X

X

         Electrical test at min, max and room temp

 

X

         Radiography

X

X

         External visual

 

 

Conformance Inspection

X

X

         Group A Electrical

 

Periodic Testing (Group B in-line or end-of-line)

X

X

         Physical dimensions

X

X

         Resistance to solvents

X

X

         Internal visual and mechanical

X

X

         Destructive wire bond strength after 300C bake

X

X

         Die shear

X

X

         Solderability

 

 

Group C One Time and for Changes

X

X

         Life Test 1000 hrs, 125C

X

X

         Internal water vapor, max 5000 ppm water

X

X

         ESD classification testing

X

X

Qualification of Processes and Material - Standard





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