Class H

Class K

Screen

Materials and Components

Active Elements (every wafer lot)

X

X

·         100% high magnification visual

X

X

·         100% probe at room temperature

X

·         Samples assembled and put through standard environmental screening including burn-in and electrical at min, max and room temp

X

·         Life test

X

·         Scanning Electron Microscope (SEM)

X

X

·         Wire bond pull

Passive elements (capacitors, resistors, inductors – per component manufacturing lot)

X

X

·         100% visual

X

·         100% electrical on select parameters at room temp

X

X

·         Sample assembled and screened including voltage aging and full electrical at room temp

X

X

·         Wire bond pull

Packages (samples per plating lot, Group D if performed in-line)

X

X

·         Physical dimensions

X

X

·         Solderability

X

X

·         Thermal shock, high temp bake, lead integrity, seal

X

X

·         Salt atmosphere (one time)

X

X

·         Metal package isolation

Hybrid Microcircuit 100% Testing

X

·         Non-destructive bond pull

X

X

·         Internal visual inspection

X

X

·         Temperature cycling 10 times from -65°C to 150°C

X

X

·         Constant acceleration 3,000 G

X

·         PIND 1% PDA on 5^th run and under 25T total

X

·         Burn-in 160 hours at 125°C, PDA 10%

X

·         Burn-in 320 hours at 125°C, PDA 2% second half of burn-in

X

X

·         Seal (fine and gross)

X

X

·         Electrical test at min, max and room temp

X

·         Radiography

X

X

·         External visual

Conformance Inspection

X

X

·         Group A Electrical

Periodic Testing (Group B in-line or end-of-line)

X

X

·         Physical dimensions

X

X

·         Resistance to solvents

X

X

·         Internal visual and mechanical

X

X

·         Destructive wire bond strength after 300°C bake

X

X

·         Die shear

X

X

·         Solderability

Group C – One Time and for Changes

X

X

·         Life Test 1000 hrs, 125°C

X

X

·         Internal water vapor, max 5000 ppm water

X

X

·         ESD classification testing

X

X

Qualification of Processes and Material - Standard