High Density Interconnects

In this world of rapidly changing technologies, one constant is the need for continually increasing the density of electronic circuits to meet the size and weight constraints of ever more complex systems. For 50 years, Teledyne Advanced Electronic Solutions has met the challenge with creative packaging solutions for today’s most demanding applications.

  • Multichip  Packages (MCP)
  • System on a Package (SOP)
  • Plastic Ball Grid Array (PBGA)
  • Quad Flat Package No Leads (QFN)
  • Single Chip Packages

 

Contact our team to find out how we can help solve your toughest design and manufacturing challenges.

Teledyne Advanced Electronic Solutions | Microelectronics | 1425 Higgs Road, Lewisburg, TN 37091 | Terms and Conditions
[p] 931.359.4531 & 800.518.1015 | microelectronics@teledyne.com |
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