BGA Attach and Reballing

Teledyne Advanced Electronic Solutions provides a variety of BGA (ball grid array) and CGA (column grid array) solutions for high density interconnect solutions.  The BGA provides maximum density with lower thermal resistance and more efficient inductance.

  • BGA - 1.27 to 1.00 mm pitch and 0.90 to 0.60 mm ball diameter
  • micro BGA -0.80 to 0.5 mm pitch and 0.55 to 0.35 mm ball diameter
  • Various package size
  • Variety of substrates
  • Polyimide (N7000-1)
  • BT (Bismaleimide/Triazene)
  • Proprietary high glass transition
  • Standard and custom PBGAs
Teledyne Advanced Electronic Solutions | Microelectronics | 1425 Higgs Road, Lewisburg, TN 37091 | Terms and Conditions
[p] 931.359.4531 & 800.518.1015 | microelectronics@teledyne.com |
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