Specialty Underfill and Encapsulation

Teledyne Advanced Electronic Solutions uses a variety of specialty, new generation underfill encapsulants  to enable higher temperature processing and applications.  The use of an underfill encapsulant in flip chip assembly significantly increases reliability by reducing strain on solder bumps during thermal cycling.   The team at Teledyne AES will determine the best suitable underfill material for your application.

Teledyne Advanced Electronic Solutions | Microelectronics | 1425 Higgs Road, Lewisburg, TN 37091 | Terms and Conditions
[p] 931.359.4531 & 800.518.1015 | microelectronics@teledyne.com |
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