Substrate/Package Stack-up Analysis

Teledyne Advanced Electronic Solutions approach to substrate design starts with a sizing study of major components and available technologies.  Teledyne works with multiple materials to select the appropriate material for the job including:

  • Low temperature co-fired ceramic (LTCC)
  • High temperature co-fired ceramic (HTCC) 
  • Thick film ceramic (AlN and BeO)
  • FR4/Rogers
  • Direct Bond Copper (DBC)


Characteristics to consider include:  range of dielectric constants, operating frequencies, thermal properties, dissipation factor, temperature stability, mechanical strength and cost.  By combining the right mix of properties, the result is a product that offers excellent electrical performance, while significantly increasing the density of the integrated components and reducing the package module footprint.  This ensures a high reliability, technologically superior product tailored to match specific application needs.


For board layout and simulation, Teledyne utilizes a vareity of design tools.  These tools allow for ongoing design simulation to predict and eliminate signal and power integrity problems early. The end result is a design that optimizes topologies and terminations of clocks and other critical signals prior to board layout, providing a comprehensive signal integrity and timing verification and analysis.


Teledyne's substrate design experience enables us to select the standard process and material combinations best suited for your requirements.

Teledyne Advanced Electronic Solutions | Microelectronics | 1425 Higgs Road, Lewisburg, TN 37091 |
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