Teledyne Microelectronic Technologies Celebrates Half a Century of Innovation

March 11, 2014

LOS ANGELES, Calif. and LEWISBURG, Tenn. – March 11, 2014 - Teledyne Microelectronic Technologies (TMT), the industry leader in microelectronics packaging, is celebrating its 50th anniversary. For half a century, TMT’s Los Angeles facility served as the manufacturing center of excellence for multi-chip modules and advanced microelectronics packaging solutions for the aerospace, defense, medical and industrial markets. In 2013, TMT moved its production facility to Lewisburg, Tenn., where it is poised for the next half century of innovation and agile service to meet our customer's requirements.

Established in 1964, TMT has been at the forefront of microelectronics packaging innovation. Over the past half century, TMT has produced millions of microelectronic circuits that have performed countless hours of service. Pioneering space- level electronics for NASA, Teledyne microcircuits are still operating on the Voyager space probe now beyond the solar system, far exceeding life expectancy. Teledyne is the leading trusted source for virtually every industry, for a broad range of microelectronic manufacturing disciplines, in the smallest form factors.

“In this world of rapidly changing technologies and ever more complex systems, TMT continues to evolve to meet new paradigms in size, weight and performance,” said Shane Green, Vice President and General Manager of Teledyne Microelectronics Technologies. “We take pride in our quality and ability to meet and exceed our customer’s expectations by providing innovative solutions and superior service.”

TMT completed its move to Lewisburg, Tenn. in 2013, creating a synergistic and more cost effective business model that maximizes Teledyne’s brand pedigree. As Green explained, “This move allows us to provide better service to our customer with a vertically integrated turn-key manufacturing answer. The addition of high reliability hermetic packaging complements our existing high density, high complexity circuit card assemblies, providing our customer with a one stop packaging solution.”

About Teledyne Microelectronic Technologies
Teledyne Microelectronics Technologies, a Department of Defense (DoD) Trusted Source for microelectronics, is a leading supplier of multichip modules (MCMs) and custom microelectronics packaging solutions. Teledyne Microelectronics Technologies provides design, manufacturing, test services and technical expertise to the DoD community, medical, communications and high-end industrial markets and is globally recognized for its complex packaging and miniaturization solutions where size and weight are critical parameters and performance must be optimized. For more information on Teledyne Microelectronics Technologies, visit

About Teledyne Technologies
Teledyne Technologies is a leading provider of sophisticated instrumentation, digital imaging products and software, aerospace and defense electronics, and engineered systems. Teledyne Technologies’ operations are primarily located in the United States, Canada, the United Kingdom, and Western and Northern Europe. For more information, visit Teledyne Technologies’ website at

Sharon Fujimoto Fletcher
Marketing Communications Manager
Phone: 310-574-2068


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