Fiber Array Auto Alignment
Thermal management is a critical element in system reliability reduction of MTBF (Mean Time Between Failure). Every 10°C increase in component temperature beyond 100°C reduces its MTBF by as much as 50 percent.
Teledyne Microelectronics thermal analysis via model simulation identifies all major heat-transfer mechanisms, including convection, conduction, and radiation. This makes it possible to identify component and PCB hot spots, perform solution-oriented trade-offs analysis on component placement and stackup design, as well as mechanical cooling techniques. A good solution goes a long way toward the prevention of component overheating.