Teledyne Microelectronic Technologies has been a pioneer and market leader in developing and offering a full range of design, modeling, alignment, packaging, Telecordia qualification and testing solutions for Industrial, Military, and Aerospace optoelectronic modules.

Program experience includes: 2 Gbps Quad Channel Transceiver, 10 Gbps Receiver, 10 Gbps TOSA, Wavelength locked light source, MEMS mirror array (n x n) optical switch, Laser Pump Module for Raman Amplifier, Tunable wavelength laser source, DWDM Tx/Rx, Mach-Zehnder waveguide modulator, High power laser sources (up to 10W), MEMS HUD, MEMS F-P interferometer based navigation grade accelerometer, Fiber Bragg grating array for optical gain control, Fiber optic pressure sensors.

Our process services include alignment, single and multi-mode fiber, Fusion splicing regular and PM fibers, Multi-channel fiber (array), Free-space optical alignment, Alignment for high power (up to 10 W), Hermetically sealed fiber packaging, Single fiber and multi-fiber array, In-house fiber metallization, Single and Multi-mode fiber tip lensing, Multiple fiber termination technologies, Thick and thin film substrates, optical bench fabrication, V-Groove fabrication (2 Ch - 128 Ch), Beam profile characterization

Our design & analysis services include: Optical Modeling - Near field (BeamProp), Free-space (ZEMAX); Lensing - Micro-lens array, Fiber tip lens (SM&MM), Free-space collimation and focusing; Thermal and Mechanical Modeling - SolidWorks/COSMOS, ANSYS, ProE/MECHANICA; Small Form Factor (SFF) Packaging - TOSA, ROSA, TxRx

Give us your most complex circuits and we will: enhance your design for manufacturability, miniaturize size and reduce weight, maintain or enhance performance and reliability, maximize thermal management, and provide comprehensive testing and screening.