Fine Pitch Wire Bonding

Process Technology: Optoelectronic Modules

Wire bonding is the predominant method for the attachment of unpackaged active die directly to the substrate.  As demands for a smaller device footprint increases, so has the need for finer tolerances on wire bond process components become tighter.  Depending on the substrate technology and conditions of use, fine pitch wire bonding can be performed using gold (Au) or aluminum (Al) wires, utilizing either thermosonic or ultrasonic techniques.  At Teledyne Advanced Electronic Solutions, wire bonding is one of our core competencies.  Our team of engineers, technicians and operators bring decades of expertise  to ensure the success of your project.

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