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Low Cost Packaging Alternatives
 

  • Plastic DIP (dual in-line) and SIP (single in-line) package
  • Mixed mode - chip & wire and surface mount on laminate
  • Direct bond copper (DBC) assemblies




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Teledyne Microelectronics • 12964 Panama Street, Los Angeles, CA 90066
310.822.8229 • 800.518.1015 | microelectronics@teledyne.com
Copyright © 2009 Teledyne Technologies Incorporated. All rights reserved.