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Plastic DIP (dual in-line) and SIP (single in-line) package Mixed mode - chip & wire and surface mount on laminate Direct bond copper (DBC) assemblies
Teledyne Microelectronics • 12964 Panama Street, Los Angeles, CA 90066 310.822.8229 • 800.518.1015 | microelectronics@teledyne.com Copyright © 2008 Teledyne Technologies Incorporated. All rights reserved.
