Teledyne Achieves AS9100 ISO 9001:2000 Accreditation at its Manufacturing Center in Mexico

LOS ANGELES, Calif. - September 8, 2009 - Teledyne Microelectronics Technologies, a business unit of Teledyne Technologies Incorporated (NYSE: TDY), announced today that it has received AS9100 ISO 9001:2000 accreditation for its Manufacturing Center in Mexico.

Since October of 1995, Teledyne Microelectronics Technologies, based in Los Angeles, has been accredited to AS9100 ISO 9001:2000 and recently had its Manufacturing Center in Mexico undergo and pass certification to AS9100 ISO 9001:2000. The Los Angeles-based facility provides high-density, high-reliability microelectronic solutions for aerospace, space, defense and medical applications. The Mexico Manufacturing Center produces high-volume, low-mix devices including solid state relays for telecommunications and industrial applications.

"Our customer base, which includes the U.S. Government and prime contractors demand uncompromising quality, reliability and delivery. The AS9100 ISO 9001:2000 accreditation in combination with our DOD Trusted Source accreditation, as well as numerous customer certifications and awards, are important factors in our company-wide initiative to deliver high-reliability microelectronic devices that meet our customers’ stringent requirements," said Bruce Gecks, Vice President and General Manager of Teledyne Microelectronic Technologies. "The accreditation of both our Los Angeles and Mexico facilities positions our business unit to better meet the needs of our customers and reflects our commitment to offer the highest quality devices and services within our industry."

ISO is the International Organization for Standardization and ISO 9001 is a globally accepted standard that specifies requirements for a quality management system where an organization needs to demonstrate its ability to consistently provide product that meets customer and applicable regulatory requirements, and aims to enhance customer satisfaction through the effective application of the system, including processes for continual improvement of the system and the assurance of conformity to customer and applicable regulatory requirements.

Teledyne Microelectronics Technologies, a Department of Defense (DOD) Trusted Source for microelectronics, is a leading supplier of multichip modules (MCMs) and custom microelectronics packaging solutions. Teledyne Microelectronics Technologies provides turnkey design, manufacturing, test services and technical expertise to the DOD community, medical, communications and high-end industrial markets and are internationally known for its complex packaging and miniaturization solutions where size and weight are critical parameters and performance must be optimized. For more information on Teledyne Microelectronics Technologies, visit www.teledynemicro.com.

Teledyne Technologies is a leading provider of sophisticated electronic subsystems, instrumentation and communication products, engineered systems, aerospace engines, and energy and power generation systems. Teledyne Technologies' operations are primarily located in the United States, the United Kingdom, and Mexico. For more information, visit Teledyne Technologies' website at www.teledyne.com.

Contact:
Sharon Fujimoto Fletcher
Marketing Communications Manager
(310) 574-2068