Concurrent to the electrical and RF design cycle, critical thermal requirements will be analyzed.
Power dissipation and heat transfer must be managed so that temperature related performance degradation can be minimized. This involves a conservative overall thermal management design that addresses the package as well as thermal interface at the next level CCA. In an RF package design, the CuMoly base in conjunction with void-free AuSn eutectic attach is the industry standard thermal management approach. This approach had been proven in many Teledyne designs qualified for operating and storage temperature ranges beyond -55°C to +100°C. It is important to note that appropriate and adequate heat transfer interface, such as attachment and heat-sinking, at the next level CCA, is available.
The overall thermal management system will be modeled and simulated by utilizing Finite Element Analysis (FEA) software tools, such as, ANSYS, SolidWorks, etc. Iterative simulation runs will be performed to verify overall thermal performance, and assess long term reliability with respect to junction temperatures.
Teledyne Advanced Electronic Solutions thermal analysis via model simulation identifies all major heat-transfer mechanisms, including convection, conduction, and radiation. This makes it possible to identify component and PCB hot spots, perform solution-oriented trade-offs analysis on component placement and stackup design, as well as the mechanical cooling techniques. A good solution goes a long way toward the prevention of component overheating.