Electrical Design & Substrate Layout

Process Technology: RF Microwave Assemblies

At Teledyne Advanced Electronic Solutions, our dedicated team of scientists and engineers work with you to optimize your size, weight and performance (SWaP) requirements. 

Design Tools:

  • Pro Engineering, Pro Mechanica, COSMOS, SolidWorks
    • 3D Mechanical Design
    • FEA, Stress Analysis, Thermal Analysis, Dynamic Analysis
  • Mentor Graphics MCM Station
    • Schematic Capture
    • Autorouting
    • High Speed/Crosstalk Analysis
    • Idea - Schematic Capture, Digital Simulation
    • Quick Fault - Test Vector Generation
  • OrCad
    • Schematic Capture
    • Autorouting
  • AutoCAD
    • Substrate layout
    • Hybrid packaging design
    • Microelectronic interconnection
  • PSPICE
    • Design, Analysis and Simulation

Teledyne Advanced Electronic Solutions | Microelectronics | 1425 Higgs Road, Lewisburg, TN 37091 | Terms and Conditions
[p] 931.359.4531 & 800.518.1015 | microelectronics@teledyne.com |
Copyright 2017 Teledyne Technologies Incorporated. All rights reserved.