Teledyne Microelectronic Technologies A Teledyne Technologies Company   

Home    Company Info    Products & Services    Teledyne Companies


New Products
PC605
HRIP SFF Fiber Optic Devices
Alphalight™ LED Backlights

Packaging Solutions
Mixed Signal
LED Backlights & Illuminators
Medical
Optoelectronics
Power
RF/Microwave
Secure Communications
Space

Technology
Capabilities
Tools

Company Info
About Us
Quality Assurance
DOD Trusted Manufacturer
Press Releases
Tradeshows
Environmental Policy
Terms and Conditions
Supplier Information

Contact
Contact Us
Sales Representatives
Map & Directions
Search
Electrical Design
 

  • Design of Transmitter Modulation Drivers using Microwave Office/HFSS
  • Design of Receiver Baseband circuitry (TIAs/Limiters) using Microwave Office/HFSS
  • Design of impedance maintaining interconnects for signal routing
 
  • Microstrip
  • Co-planar waveguide
  • Rigid Substrate & Flex
  • FlipChip
Using AutoCad,
SolidWorks, HFSS
& Microwave Office
  • Design of wideband I/O transitions (to 40 GHz)
 
  • Coax
  • Microstrip (SMT)

Using AutoCad,
SolidWorks, HFSS
& Microwave Office
  • Design of housing cavities carrier plates and substrates that are free of spurious coupling modes using HFSS and SolidWorks




Home | ISO 9001 | Terms of Use | Careers | Search | Contact

Teledyne Microelectronics • 12964 Panama Street, Los Angeles, CA 90066
310.822.8229 • 800.518.1015 | microelectronics@teledyne.com
Copyright © 2008 Teledyne Technologies Incorporated. All rights reserved.