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Case to Cover Resistive seam seal Laser weld Electrical I/O Glass feed throughs Co-fired planar ceramic metal BGA (Ball Grid Array) (including microwave) Fine/Gross Leak Testing Classical methods Seam Seal
Teledyne Microelectronics • 12964 Panama Street, Los Angeles, CA 90066 310.822.8229 • 800.518.1015 | microelectronics@teledyne.com Copyright © 2010 Teledyne Technologies Incorporated. All rights reserved.
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