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Part Traceability
 

  • Sequential internal trace numbers are assigned to individual vendor lots
    • Packaged electronic components
    • Bare semiconductor dice in waffle packs
    • Semiconductor wafers
  • Traceabliity is achieved as follows for:
    • Packaged electronic components
      • By lot or date code
    • Semiconductor dice and wafers
      • By diffusion lot and wafer number
    • Bulk material and line flow
      • By lot number




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Teledyne Microelectronics • 12964 Panama Street, Los Angeles, CA 90066
310.822.8229 • 800.518.1015 | microelectronics@teledyne.com
Copyright © 2008 Teledyne Technologies Incorporated. All rights reserved.