| TE Cooler Attachment
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- Flux based solder methods
- Solder preforms/pastes
- Surface coverage: (> 90%)
- Height (thickness) control:
(+/- 5 microns)
- Fluxless solder methods
- Epoxy based methods
- B-Stage preforms
- Surface coverage: (> 90%)
- Height (thickness) control:
(+/- 5 microns)
- Auto dispensed
- Surface coverage: ( > 90% )
- Height (thickness) control:
(+/- 5 microns)
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Belt Furnace
Sonoscan
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