Teledyne Microelectronics provides a full range of mechanical design and build to print packaging services for digital and analog hybrids, multichip modules and system in a chip packages for cryptographic applications. We specialize in anti-tamper (AT) solutions that provide a protective shield against illegal entry and the extraction of critical data.
All engineering, manufacturing, screens and test are performed in our DMEA accredited facility in Lewisburg, Tennessee. We manufacutre multichip modules and system in a chip packages that meet the requirements of and are qualified per MIL-PRF-38534 and FIPS 140-2. We offer design and build-to-print services and hermetic and non-hermetic packages.
Contact our team to find out how we can help solve your toughest secure communications design and manufacturing challenges.