Specialty Underfill and Encapsulation

Process Technology: Secure Communication Devices

Teledyne Advanced Electronic Solutions uses a variety of specialty, new generation underfill encapsulants  to enable higher temperature processing and applications.  The use of an underfill encapsulant in flip chip assembly significantly increases reliability by reducing strain on solder bumps during thermal cycling.   

Teledyne Advanced Electronic Solutions | Microelectronics | 1425 Higgs Road, Lewisburg, TN 37091 |
[p] 931.359.4531 & 800.518.1015 | microelectronics@teledyne.com |
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