Teledyne Microelectronic Technologies provides a full range of mechanical design and build to print packaging services for digital and analog hybrids and multichip modules for Cryptographic applications. We specialize in Anti-Tamper coatings that provide a protective shield against illegal entry and the extraction of critical data.

The engineering, manufacturing, screens and test are performed in a DoD cleared facility and work force with areas set aside for classified assembly and test. These MCMs meet the requirements of and are qualified per MIL-PRF-38534 & FIPS 140-2. We offer Design and Build-to-Print services as well as Hermetic and Non-Hermetic Packages.

We are recognized as the market leader for Military, Aerospace, and Medical programs, offering over 40 years experience with signal processing, interface control modules, memory modules, armament control, avionics, power modules, implantable medical devices and LED display modules.

Give us your most complex circuits and we will: enhance your design for manufacturability, miniaturize size and reduce weight, maintain or enhance performance and reliability, maximize thermal management, and provide comprehensive assembly, testing and screening.