Epoxy Die Bonder
Three-dimensional (3D) integration has long been considered the most advanced technique for reducing the overall size of electronic assemblies. In many high-rel applications, this holds particularly true as the embodiments of the devices are rarely compatible with the conventional large flat motherboard architecture. The ultimate goal of 3D integration is to maximize volume density of the components of the electronic assembly, thus reducing its linear size.
Teledyne Advanced Electronic Solutions utilizes a variety of design concepts, from die stacking to flex folding to board interleaving to accomplish the goal. 3D integration requires a detailed understanding of material properties, highly controlled manufacturing processes, precision electrical and thermo-mechanical design and creative, proven techniques.