Teledyne Advanced Electronic Solutions dedicated team of scientists and engineers work with you to optmize your size, weight and performance (SWaP) requirements.

Design Tools:
- Pro Engineering, Pro Mechanica, COSMOS, SolidWorks
- 3D Mechanical Design
- FEA, Stress Analysis, Thermal Analysis, Dynamic Analysis
- Mentor Graphics MCM Station
- Schematic Capture
- Autorouting
- High Speed/Crosstalk Analysis
- Idea - Schematic Capture, Digital Simulation
- Quick Fault - Test Vector Generation
- OrCad
- Schematic Capture
- Autorouting
- AutoCAD
- Substrate layout
- Hybrid packaging design
- Microelectronic interconnection
- PSPICE
- Design, Analysis and Simulation