Teledyne Advanced Electronic Solutions dedicated team of scientists and engineers work with you to optmize your size, weight and performance (SWaP) requirements. 

Design Tools:

• Pro Engineering, Pro Mechanica, COSMOS, SolidWorks
  • 3D Mechanical Design
  • FEA, Stress Analysis, Thermal Analysis, Dynamic Analysis
• Mentor Graphics MCM Station
  • Schematic Capture
  • Autorouting
  • High Speed/Crosstalk Analysis
  • Idea - Schematic Capture, Digital Simulation
  • Quick Fault - Test Vector Generation
• OrCad
  • Schematic Capture
  • Autorouting
• AutoCAD
  • Substrate layout
  • Hybrid packaging design
  • Microelectronic interconnection
• PSPICE
  • Design, Analysis and Simulation