Hi-Rel Space Level Screening

Process Technology: Space Microelectronics

At Teledyne Advanced Electronic Solutions, each hybrid microcircuit will be subjected to and pass all of the applicable screening tests and inspections in accordance with Table X of MIL-H-38534 for Class "K".

(a)  Nondestructive Bond Pull, Method 2023

(b)  Internal Visual, Method 2017

(c)  Temperature Cycling, Method 1010, Condition C (10 cycles from B65EC to +150EC)

(d)  Constant Acceleration, Method 2001, Condition A (5000 g in Y1 axis)

(e)  Particle Impact Noise Detection, Method 2020, Condition B (10 g at 60 Hz)

(f)  Electrical Test, in accordance with applicable device specification

(g)  Burn‑In, Method 1015 (320 hours at +125EC)

(h)  Final Electrical Test, in accordance with applicable device specification

(i)  Seal, Method 1014 (fine leak followed by gross leak)

(j)  Radiographic, Method 2012

(k)  External Visual, Method 2009

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